What's In Your BGA Land Pattern and Footprint | Zach Peterson | Component Creation | Altium Designer
BGA Land Pattern Design for Manufacturability
Ball grid array - Wikipedia
AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AI)
Find all TI packages | Texas Instruments
BQ25101: Land pattern design - "Non-solder mask defined" for DSBGA and X2SON - Power management forum - Power management - TI E2E support forums
NASA Guidelines for Ball Grid Array (BGA) and Die-Size BGA (DSBGA) Selection and Application
BQ25101: Land pattern design - "Non-solder mask defined" for DSBGA and X2SON - Power management forum - Power management - TI E2E support forums
AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AI)
BGA Land Pattern Design for Manufacturability
BGA Pad Size - PCB Libraries Forum
TPS63050: TPS63050YFFR land pattern layout information - Power management forum - Power management - TI E2E support forums
NASA Guidelines for Ball Grid Array (BGA) and Die-Size BGA (DSBGA) Selection and Application
BGA Component Package | mbedded.ninja
DSBGA: Die Size Ball Grid Array, Die Size BGA | MADPCB
Understand the BGA Pitch Design and more - Printed Circuit Board Manufacturing & PCB Assembly - RayMing
Capabilities for DSBGA and other Complex Components
What's In Your BGA Land Pattern and Footprint | Zach Peterson | Component Creation | Altium Designer
TN1074 - PCB Layout Recommendations for BGA Packages
TN1074 - PCB Layout Recommendations for BGA Packages
BGA Component Package | mbedded.ninja
AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AI)
SN74AUP1G32 Low-Power Single 2-Input Positive-OR Gate datasheet (Rev. I)
